| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the yield of a wiring board which is to be mounted with an LSI of high integration. SOLUTION: As to a land pattern on a wiring boards which is mounted with a high-integration LSI, an interlayer connection hole arrangement for a power supply and a grounding is arranged outside of a signal interlayer connection hole arrangement. That is, interlayer connection holes 55 and 56 which are each connected to a power supply land pattern 53 and a grounding land pattern 54 out of land patterns 53, 54, and 58 that are laid inside are gathered and arranged so as to be located outside of an arrangement pattern of interlayer connection holes 59 which are each connected to the signal lands 58.</p> |
