| 摘要 |
PROBLEM TO BE SOLVED: To restrain air bubbles from penetrating into a gap between two wafers so as to improve a laminated semiconductor substrate in reliability by a method wherein two wafers are each deformed into a convex spherical surface, and the convex wafers are bonded together. SOLUTION: Two wafers 1 and 11 are sucked up with a vacuum suction chuck formed of elastic body such as silicone rubber to the like and each converted into a convex spherical surface. The convex wafers 1 and 11 are made to approach each other to bring their center parts into contact with each other, then gradually brought into full contact with each other including their peripheral parts. The vacuum suction chuck is controlled in suction pressure, and then the wafers are joined together into a laminated wafer 12 with the vacuum chuck returned to a normal pressure. By this setup, air bubbles are restrained from penetrating between two wafers, so that the wafer 12 can be improved in reliability. |
