| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of enhancing a bonding strength in stability ensuring a bonding strength to a conductor for a package interposition board equipped with a terminal bonding pad used for forming a protrudent electrode by bonding various kinds of conductor such as a solder ball, a bump electrode, and the like. SOLUTION: Plating resist is applied on all the top surface of a BGA wiring board. A terminal pad forming part 131 formed on the under surface of the BGA wiring board is plated with silver for the formation of a surface layer 132 which serves as a terminal bonding pad. Then, the BGA wiring board is cleaned, the plating resist is removed, then the BGA wiring board is cleaned again, and the under surface of the BGA wiring board is coated with plating resist. A surface layer is formed on a chip-side pad forming part provided on the top surface of the BGA wiring board, and a chip connection pad covered with a gold coating layer is formed. |
