SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

摘要

PURPOSE: A semiconductor device is provided to secure the process margin and reduce the chip size by prevent misalignment of a mask in the process of interlayer-connecting between upper and lower layers. CONSTITUTION: The semiconductor device includes the first pad(11A) aligned in a straight line to the first direction(Y axis). The first word lines(11) are connected to both sides of the first pad(11A) in the second direction(X axis) vertical to the first direction(Y axis). The second word lines(21) are located in parallel to the first word line(11) between the neighboring first word lines(11). The second pad(13) is connected to the second word line(21) via the first contact hole(12) through which the second word line(21) is exposed. The first metal pattern is connected to the first word line(11) via the second contact hole(14) through which the first pad(11A) is exposed and has a pattern shape that overlaps with the first pad(11A) and the first word line(11). The second metal layer pattern overlaps between the first metal layer pattern and is parallel to the first metal layer pattern. The second metal layer pattern is connected to the second pad(13) via the third contact hole through which the second pad(13) is exposed.