发明名称 HEAT-TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a semiconductor heat-treating device provided with a throat shutter mechanism, in which a part corresponding to the valve disc of a throat shutter can be easily cleaned, even in an airtightly closed space. SOLUTION: A semiconductor heat-treating device is provided with a throat shutter mechanism 10, which prevents the leaking-out of a heated atmosphere by closing the throat of a reaction furnace in a period, during which no heat treatment is performed in the reaction furnace, and at the same time, by sealing the inside of the reaction furnace through pressing of a valve disc section in the periphery of a throat shutter 11 of the throat shutter mechanism against the periphery of the throat, when the throat is closed. The valve disc section of the throat shutter 11 of the mechanism 10 is constituted of a seal section 35, which at least takes the place of a part substantially contributing to the sealing, a seal section holding section 36 which takes the place of parts other than the part contributing to the sealing, and a fixing section which removably fixes the sealing section 35 to the holding section 36.
申请公布号 JP2000349037(A) 申请公布日期 2000.12.15
申请号 JP19990159785 申请日期 1999.06.07
申请人 KOKUSAI ELECTRIC CO LTD 发明人 TANIYAMA TOMOSHI
分类号 H01L21/22;(IPC1-7):H01L21/22 主分类号 H01L21/22
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