| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate processor which can satisfactorily keep airtightness, even when arranging a transparent quartz container, an opaque quartz part, and a flange part horizontally. SOLUTION: This semiconductor substrate processor 10 has a transparent quartz container 11, which performs substrate processing in the inside, an opaque quartz part 12 whose one end face is welded to at least a part of the open end face of the transparent quartz container 11, a transparent quartz part 13 whose one end face is welded to at least a part of the other end face of the opaque quartz part 12 and whose other end face is processed into a plane, and a flange part 14 which puts the inside of the transparent quartz container 11 in airtight condition, by so pressing a member 15 for sealing as to catch the member between itself and the said other end face of the transparent quartz part 13, and this processor performs the treatment of the semiconductor substrate within the inside in airtight condition. The opaque quartz part 12 breaks the conduction of the heat from the transparent quartz container 11, but since it does not participate in sealing for airtightening the inside, it can satisfactorily keep airtightness without generating minute leakages, either.
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