SEMICONDUCTOR PACKAGE AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to manufacture an ultra thin semiconductor package, by positioning a semiconductor chip in a penetration hole formed in a predetermined surface area of a circuit board, so that the thickness of the semiconductor chip is offset by that of the circuit board. CONSTITUTION: A plurality of bond fingers(12) and a plurality of ball lands(15) are respectively established on upper and lower surfaces with a resin layer(11) as a center. The bond finger is connected to the ball land through a conductive via hole, and a strip-type circuit board having a plurality of penetration holes is prepared. A plurality of semiconductor chips(2) having a plurality of input/output pads on its upper surface are positioned in the respective penetration holes of the circuit board. The input/output pad of the semiconductor chip is electrically connected to a bond finger of the circuit board. A predetermined region of the semiconductor chip, connection unit and circuit board is encapsulated with an encapsulating material. A conductive ball(30) is melted and adhered to the ball land of the circuit board. The strip-type circuit board is singulated to semiconductor packages.