SEMICONDUCTOR LEAD FRAME

摘要

PURPOSE: A lead frame for semiconductor package is provided to improve a bonding power and bonding stability by enlarging a loop radius of wire when performing a ground bonding process between a semiconductor chip pad and a semiconductor chip loading plate. CONSTITUTION: A semiconductor chip loading plate(2) loads a semiconductor chip(3). A tie bar(6) supports the semiconductor chip loading plate(2). A multitude of lead(5) is extended from an outer circumference of the semiconductor chip loading plate(2) to the outside. A ground-bonding zone is formed by bending a region adjacent to one side of the semiconductor chip loading plate(2). The tie bar(6) is connected with the ground-bonding zone. The tie bar(6) with the ground-bonding zone have not a downward bent portion(7).