| 摘要 |
PROBLEM TO BE SOLVED: To allow pin connection which requires no solder or soldering process by coating a polymer thick film across the top surface and inner front surface of a substrate, and pressure fitting a pin whose diameter is smaller than that of a hole into the polymer thick film across the inner front surface. SOLUTION: Related to a double-sided printed circuit board arrangement, a polymer thick film 30, for example, is coated across the top surface 13 and the bottom substrate of a substrate 10, and further, the polymer thick film 30 is coated across an inner front surface 20 which forms a hole 25. A pin 40 whose diameter is smaller than that of the hole 25 is pressure fitted into the whole 25 while contacting the polymer thick film 30. The pin 40 is preferred to be held in the hole 25 by pressure-fitting and/or mechanical connection. This configuration requires no solder or soldering process for pin connection.
|
