发明名称 MOLD-CASTING ARTICLE
摘要 PROBLEM TO BE SOLVED: To reduce thermal stresses generated in heat cycle by performing surrounding casting with resin on the surface of a metal member via an inclusion with specific film thickness. SOLUTION: A copper conductor 1 is subjected to surface treatment as a metal member for composing a mold casting article. As an inclusion 2, a die lubricant is applied onto the outer periphery surface of the copper conductor 1 once by a brush before natural drying, and the thickness of the due lubricant is set to 0.1 to 0.3 mm. Or silicone rubber is applied to the outer periphery surface of the copper conductor 1 by the brush before being naturally dried normal temperatures, and the thickness of the silicone rubber is set to 0.1 to 0.3 mm. Or a self-fusing silicone tape is expanded by approximately 10% for winding onto the outer periphery surface of the copper conductor 1 once, and the thickness of the self fusion silicone tape is set to 0.1 to 0.3 mm, thus preventing the copper conductor 1 from being firmly bonded to resin 3. Then, the copper conductor 1 subjected to surface treatment by the inclusion 2 is surrounded by the resin 3, and the mold casting article is made. Therefore, by interposing the inclusion 2, the metal member 1 is not bonded to the resin 3, thus generating sliding between the metal member 1 and the resin 3, preventing stresses from being generated, and hence avoiding the generation of cracks is avoided.
申请公布号 JP2000350424(A) 申请公布日期 2000.12.15
申请号 JP19990154568 申请日期 1999.06.02
申请人 MEIDENSHA CORP 发明人 HAMAMURA TAKEHIRO;ICHIKAWA HIROMI
分类号 B29C39/10;H01B7/17;H02K15/12;(IPC1-7):H02K15/12 主分类号 B29C39/10
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