| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package which causes no improper connection in the case of soldering the ceramic package onto a printed circuit board. SOLUTION: Figure (a) is a plan view showing an internal electrode layout, ceramic sheets 1 are laminated to be a multi-layer, an input electrode 2a and an output electrode 3a are laid out and a ground electrode 4a is provided between the electrodes 2a and 3a. Figure (b) is a bottom view, an input terminal 2b and an output terminal 3b are laid out and a ground terminal G and ground electrode terminals 4b are provided. Furthermore, the ground electrode terminals 4b are connected diagonally to each other by a ground electrode connecting electrode 6 between the input terminal 2b and the output terminal 3b. On the other hand, notches 7 are provided in the ground electrode connecting electrode 6 in the vicinity of the ground electrode terminal 4b respectively. Figure (c) is a cross sectional view, in which it is shown that the input electrode 2a, the output electrode 3a are electrically conducted to the input terminal 2b and the output terminal 3b at the outside of the ceramic package.
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