| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board which can improve smoothness of the inner wall surface of a hole, formed in a nonhalogen printed wiring board. SOLUTION: A printed wiring board 22 is a laminate, in which three insulating boards IP1-IP3 are stacked. Each of the boards IP1-IP3 is composed of, e.g. glass epoxy resin, and formed without mixing halogenide such as boromine as the material. When a hole is formed in the wiring board 11, a patch 23 formed as a resin layer composed of resin material 22 is used on the surface of an aluminum plate 21. The patch 23 is brought into close contact with the upper surface of the wiring board 11, in such a manner that the side where the resin material 22 exists facing upward. A hole is formed from above the patch 23 by using a drill 24. The number of revolution of the drill is set at a high speed rotation (at least 100 k[rpm]), and the feed rate of the drill is set as a low speed feed (at most 55[inch/min]). |
