| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding with solder correctly without misalignment and a method of manufacturing a semiconductor device, when a semiconductor device is die-bonded to the bonding portion of a ceramic package or the like with solder. SOLUTION: A collet 2 is again lowered slightly after scribing to press a semiconductor chip 15 onto a melted solder 15 and to hold it for a while to make the thickness of the solder 15 to about 1μm, whereby the semiconductor chip is bonded to the substrate 3. This can fix solder when the semiconductor is die-bonded with solder, even if the substrate to which the semiconductor device is bonded is not removed from a heater block on which the substrate is placed and thus can perform bonding for positioning with high accuracy. |
