| 摘要 |
PROBLEM TO BE SOLVED: To provide a pad-conductivity inspecting device that can speedily cope with design change of a circuit board, perform positioning of a probe and conductivity inspection accurately, easily, and inexpensively, and after the conduction inspection, certainly connect an IC chip, an LSI package, an electronic component to a pad or a land through a bonding wire and solder. SOLUTION: A plurality of probes 11 for inspecting conduction of a pad 93 formed on a circuit board 90 are formed in a square pole shape, this outline size Lp is set to be intermediate size between an outline size D of a bonding portion and an outline size L of the pad 93, and a projection 11b with four edges as vertices 11a is formed under the probe 11.
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