LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND METHOD FOR PLATING LEAD FRAME

摘要

PURPOSE: A lead frame for semiconductor package and a method for plating a lead frame are provided to form a lead frame having a plated protective layer by applying a modulated current to an upper face of an intermediate layer. CONSTITUTION: An intermediate layer(32) is formed at one side of a metal substrate(31). A modulated current is applied to an upper face of the intermediate layer(32) by using one or more material of a palladium, palladium alloy, gold, gold alloy, silver, and silver alloy. A plated protective layer(33) of 0.01 to 1.5 micro inches is formed therefrom. The intermediate layer(32) is formed with nickel and nickel alloy.