SEMICONDUCTOR PACKAGE FOR TEST AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing a semiconductor package for test is provided to precisely measure internal stress of the semiconductor package, by establishing a stress gauge in a part of the semiconductor package, and by wire-bonding the stress gauge and an inner lead and connecting an outer lead with a tester, so that an electrical signal is inputted/outputted to/from the stress gauge. CONSTITUTION: A stress-measuring unit is fixed to one of an inner lead, an outer lead, a die pad and a semiconductor chip. Input and output terminals formed in the stress-measuring unit and a bonding pad formed in the semiconductor chip are wire-bonded to the inner lead. The inner lead, the semiconductor chip, the wire and the stress measuring unit are molded with predetermined resin.