| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a sealing resin to be improved in mechanical strength and moisture- resistance properties without deteriorating a semiconductor device in heat radiation properties by a method wherein holes are bored in a portion of a heat sink where sealing resin is superposed. SOLUTION: A heat sink 3 formed in one piece with an island 2 and a sealing resin 5 which seals up a semiconductor element 1, the heat sink 3, and functional leads 4 partially are provided. Holes 6 are bored in the heat sink 3 at positions where the sealing resin 5 is superposed on the heat sink 3 corresponding to the functional leads 4 which confront the heat sink 3 through the intermediary of the island 2. Therefore, heat released from the semiconductor element 1 is transmitted to the heat sink 3 from the island 2 located just under the semiconductor element 1 and then dissipated into the air through the intermediary of the sealing resin 5. The sealing resin 5 is enhanced in adhesion to the heat sink 3, so that the sealing resin 5 can be prevented from separating from the heat sink 3 due to the fact that a mechanical stress is induced by a thermal expansion coefficient difference between the sealing resin 5 and the heat sink 3 when a thermal stress is applied. Therefore, moisture can be prevented from penetrating into a semiconductor device, so that the semiconductor device can be improved in moisture-resistant properties and withstand pressure to mechanical stress.</p> |
