发明名称 METHOD FOR MANUFACTURING A TRENCH ISOLATION
摘要 PURPOSE: A method for manufacturing a trench isolation is provided to make a projected range of source/drain impurity ions have a relatively small region on an interface between an active region and a non active region, by forming a trench isolation layer higher than a substrate, and by forming a spacer on a sidewall of the isolation layer. CONSTITUTION: A trench etch mask is formed by sequentially forming the first insulating layer and the second insulating layer on a substrate(210). A trench is formed on the substrate by using the trench etch mask. The trench is filled up with the third insulating layer. The second insulating layer is eliminated to form a trench isolation layer(218) higher than the substrate. A gate electrode layer(224) is formed in an active region(A) of the substrate. A low density source/drain(226) is formed by injecting low density impurity ions into the active region of the substrate. Spacers(228a,228b) are formed on sidewalls of the trench isolation layer and gate electrode layer. A high density source/drain is formed by injecting high density impurity ions into the active region of the substrate.
申请公布号 KR20000074841(A) 申请公布日期 2000.12.15
申请号 KR19990019061 申请日期 1999.05.26
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 SHIN, GWANG SIK;SHIN, YU CHEOL;OH, HEUNG GWON;HUH, SEONG HOE
分类号 H01L21/76;(IPC1-7):H01L21/76 主分类号 H01L21/76
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