发明名称 APPARATUS FOR A RAPID THERMAL PROCESS
摘要 PURPOSE: An apparatus for a rapid thermal process(RTP) is provided to shorten a process time and improve productivity, by minimizing a fuzzy time taken to vent a harmful gas in a quarts tube. CONSTITUTION: An apparatus for a rapid thermal process(RTP) comprises a quartz tube(100), a sealing unit(104), an internal gas supply line(106), a vent line(108), a door plate(110), a door moving cylinder(112) and a normal open type air valve(118). The quartz tube has a quadrilateral type, in which a wafer is loaded/unloaded. The sealing unit is adhered to a former part of the quartz tube, having a frame type with an O-ring(102). The internal gas-supply line supplies gas into the quartz tube, connected to a predetermined part of a latter part of the quartz tube. The vent line vents gas in the quartz tube to the exterior, connected to a predetermined lower portion of the sealing unit. The door plate seals up the quartz tube, closely adhered to the front surface of the sealing unit by intervening the O-ring. The moving cylinder has a structure composed of the first air line functioning to isolate the door plate from the sealing unit and the second air line functioning to adhere the door plate to the sealing unit. The normal open type air valve becomes closed when condensed air is injected into the first air line to prevent external air from being induced to the vent line.
申请公布号 KR20000074512(A) 申请公布日期 2000.12.15
申请号 KR19990018512 申请日期 1999.05.21
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 HA, TAE CHUL
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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