发明名称 BAKE OVEN SYSTEM FOR UNIFORMLY HEATING A SEMICONDUCTOR WAFER
摘要 PURPOSE: A bake oven system is provided to improve uniformity of a line width on a semiconductor wafer in a bake process and to increase yield of the semiconductor wafer, by uniformly transferring heat to the entire surface of the semiconductor wafer. CONSTITUTION: A bake oven system(200) for uniformly heating a semiconductor wafer(208) comprises a base(212) and a heat transfer unit. The base oven system has the semiconductor wafer in an inner space. The base has a surface on which the semiconductor wafer is placed, and a heater for heating the semiconductor wafer. The base is established in the inner space. The heat transfer unit uniformly transfers heat to the semiconductor wafer.
申请公布号 KR20000075415(A) 申请公布日期 2000.12.15
申请号 KR19990046401 申请日期 1999.10.25
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 BAE, YONG GUK;LEE, GANG SIK
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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