| 摘要 |
PURPOSE: A method and an apparatus for performing a leveling process of a wafer exposure system is provided to shorten a leveling time by driving moving points along a center portion of a stage. CONSTITUTION: A sloped light is irradiated to an exposing face of a wafer(30) loaded on a stage(32). A leveling process is performed by detecting the light reflected from the exposing face of the wafer(30). The first slope variation process for the first moving points(34,38) is performed. The first moving points(34,38) correspond to both ends of one axis passing through a center of the stage(32). The second slope variation process for the second moving points(36,40) is performed. The second moving points(36,40) correspond to both ends of the other axis passing through the center of the stage(32).
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