发明名称 SEMICONDUCTOR DEVICE PROBE STATION, ITS COOLING APPARATUS, ITS COOLING METHOD, AND EDS METHOD THEREOF
摘要 PURPOSE: A semiconductor probe station, an apparatus an a method for cooling the same, and an EDS(Electrical Die Sorting) method thereof is provided to test a state of a chip by checking electrical characteristics of each chip formed on a wafer. CONSTITUTION: An EDS process is performed to test a normal state or an abnormal state of a chip in a semiconductor probe station. A cooling device(36) is included within the semiconductor probe station. In the probe station, a station performs the EDS process. A platen(26) is formed on the station. A forcer(28) is formed on the platen(26). A mobile portion moves the forcer(28). A probe chuck(30) is installed on the forcer(28). A wafer(16) is adsorbed on an upper face of the probe chuck(30) according to an operation of a vacuum device. The cooling device(36) falls down a temperature of the probe chuck(30).
申请公布号 KR100274595(B1) 申请公布日期 2000.12.15
申请号 KR19970051213 申请日期 1997.10.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, YOUNG NAM;KIM, JAE KYU;LEE, JONG HUN;SIN, YU KWANG
分类号 H01L21/66;G01R31/28;(IPC1-7):H01L21/66 主分类号 H01L21/66
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