METHOD FOR MANUFACTURING CHIP SCALE PACKAGE

摘要

PURPOSE: A method for manufacturing a chip scale package(CSP) is provided to form a thin elastomer, by having an electrode pad and a beam lead of a semiconductor chip connected on an active surface of the chip by wire bonding. CONSTITUTION: A polyimide tape(21) having a window(27) in the center is prepared. A tape wiring board(20) is prepared which has a wiring pattern including a plurality of beam leads(25) projected over the window, and is formed on the polyimide tape on both sides of the window. Elastomer(30) is uniformly applied on the surface of the tape wiring board having the wiring pattern with the window as a center. A semiconductor chip having a plurality of electrode pads(12) along a central portion of an active surface is prepared. The active surface is adhered to the tape wiring board to expose the electrode pads over the window. The beam leads and electrode pads of the chip exposed to the window are electrically connected with a bonding wire(40). The bonding wire is ball-bonded to the electrode pad by using a capillary. After the capillary is lifted, the bonding wire is stitch-bonded by pressing the beam lead corresponding to the electrode pad on the active surface. A resin encapsulating unit(60) is formed by encapsulating portions exposed to the window and an outer portion of the semiconductor chip. A plurality of solder balls electrically connected to the semiconductor chip is formed on a surface opposite to the tape wiring board having the wiring pattern.