| 摘要 |
PROBLEM TO BE SOLVED: To provide a precision taking-up form for extending a life until a flaw occurs on a wire by taking up a bonding wire, after wire drawing, around a spool while guided with a non-rotative take-up guide, with the take-up guide comprising a hard base material coated with a diamond-like carbon film. SOLUTION: A bonding wire for semiconductor element is taken up around a spool 4 using a non-rotative take-up guide 5 to a specified taken-up length and form chiefly for bonding work of a semiconductor element, and then delivered. The non-rotative take-up guide 5 comprises two rod-like guides 6, and a bonding wire 2 is guided between two rod-guides 6. As a take-up guide base material, a hard base material coated with a diamond-like carbon film is used. The hard base material includes a hard metal, ceramics, and glass, etc. Precision taking-up is allowed even at cross multi-layer winding, for extended life of a guide. |
