| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for soldering using the solder which does not include organic lead, and is fine in texture, small in changeover aging, and superior in heat-resistance and fatigue. SOLUTION: In the solidifying process of soldering using Sn-Ag-Bi-Cu-In based solder alloy containing 80 to 92 wt.% Sn, 2.5 to 4.0 wt.% Ag, 5 to 18 wt.% Bi, 0.1 to 0.7 wt.%, and 0.1 to 1.5 wt.% In, the solder alloy is quenched and solidified to finely disperse inter-metal compounds. |
