| 摘要 |
PROBLEM TO BE SOLVED: To obtain an aligner in which a wafer can be set at a plurality of temperatures even without arranging and installing a plurality of heating means, cost increase of the device is suppressed and in which an increase in an installation area is suppressed by a method wherein the working degree of a heating means is changed and the temperature of the wafer is controlled to a plurality of temperatures. SOLUTION: A hot plate 19 which is installed inside a heating treatment chamber 13 is controlled to a required maximum temperature by a temperature control device 20. A wafer 1 is held by a robot arm 2 so as to be placed on the hot plate 19. The robot arm can be turned around a holding shaft and moved up and down, and its movement is controlled by a robot-arm control device 4. The temperature of the hot plate is set at, e.g. 120 deg.C, and its contact time is set at one to two seconds. Then, the temperature of the wafer is adjusted to 23 deg.C. A member 3 which controls the distance between the wafer and the hot plate is installed in the peripheral part of the hot plate 19 so as to be used as required, and the temperature of the wafer is controlled. |
