MANUFACTURE OF NONCONTACT IC CARD

摘要

PROBLEM TO BE SOLVED: To obtain high manufacture efficiency and to prevent a machining device from becoming dirty in a heating and pressing process by forming and then heating and pressing a stack body formed by sandwiching a specific plastic film and then providing parting films of different materials on the outer surfaces of respective plastic sheets. SOLUTION: Two plastic sheets having heat-sealable adhesion parts 3 are arranged so that the adhesion parts 3 are opposite to each other, a plastic film 7 where an IC chip 5 and an antenna loop coil 6 are wired is sandwiched between them, and parting films 8 which are made of different materials are provided on the outer surfaces of the plastic sheets 8. This stack body is heat and pressed. At this time, the two parting films 8 stops the resin constituting the adhesion part 3 from protruding by being softened in the heating and pressing process, so the press plate and laminator roll of a working device can be prevented from being stained.