| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor wafer of superior mass production and reproducibility. SOLUTION: A process where a first member, which has a single-crystal semiconductor layer 5 on a semiconductor basic substance 1 with a separating layer 4 in between, is formed with a semiconductor wafer as raw material, a transfer process where the single-crystal semiconductor layer 5 is isolated by the isolation layer 4 to transfer onto a second member 2 formed of the semiconductor wafer, and a planarizing process where a surface of the semiconductor basic substance 1 is, after the transfer process, flattened to use the semiconductor basic substance as a semiconductor wafer, having uses other than that of the semiconductor wafer used for the first and second members, are contained.
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