| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wafer-cleaning device which can prevent the occurrence of failures in the device as a whole, even when the sealability of a hermetically sealing member is deteriorated. SOLUTION: A wafer-cleaning device is constituted, in such a way that a cleaning chamber A in which a wafer is cleaned by means of a cleaning means, while the wafer is rotated and a driving power section (an air cylinder 4b, etc.), which drives each member in the chamber A are separated from each other by a partitioning member A1 and the drive power of the drive power section is transmitted to the chamber A, by inserting a drive power transmitting mechanism (a connecting member 60, etc.), coupled with the drive power section into the chamber A through the opening 34a of the partitioning member A1. A weir 31, which surrounds the peripheral of the driving power transmitting mechanism and is protruded into the chamber A, is provided in the opening 34a of the member A1. In addition, a flexible hermetically sealing member 29, which tightly seals the opening 34a of the member A1, is fitted to the part of the cleaning chamber A surrounding the weir 31.
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