发明名称 METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCREASING HYDROGENATION EFFECT
摘要 PURPOSE: A method of forming a semiconductor device for increasing a hydrogenation effect is provided to perform a hydrogenation process by using a cap layer with a low hydrogen diffusion coefficient. CONSTITUTION: A source(22) and a drain(23) are formed on a substrate(21). An active layer is formed between the source(22) and the drain(23). An insulating layer(24) is formed to insulate the active layer. A gate(25) is formed on the insulating layer(24). An insulating layer(28) is formed to insulate each device of a transistor. Electrodes are formed on the source(22) and the drain(23), respectively. A plasma nitride layer(29) is formed on an upper portion of the whole structure. A cap layer(30) is formed on the plasma nitride layer(29). A thermal process is performed to diffuse hydrogen generated from the plasma nitride layer(29) to the transistor formed with the cap layer(30).
申请公布号 KR100275715(B1) 申请公布日期 2000.12.15
申请号 KR19930030229 申请日期 1993.12.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, BYUNG-HOO
分类号 H01L21/22;H01L21/30;H01L21/31;H01L21/318;H01L21/336;H01L23/29;H01L29/78;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L21/22
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