发明名称 |
METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCREASING HYDROGENATION EFFECT |
摘要 |
PURPOSE: A method of forming a semiconductor device for increasing a hydrogenation effect is provided to perform a hydrogenation process by using a cap layer with a low hydrogen diffusion coefficient. CONSTITUTION: A source(22) and a drain(23) are formed on a substrate(21). An active layer is formed between the source(22) and the drain(23). An insulating layer(24) is formed to insulate the active layer. A gate(25) is formed on the insulating layer(24). An insulating layer(28) is formed to insulate each device of a transistor. Electrodes are formed on the source(22) and the drain(23), respectively. A plasma nitride layer(29) is formed on an upper portion of the whole structure. A cap layer(30) is formed on the plasma nitride layer(29). A thermal process is performed to diffuse hydrogen generated from the plasma nitride layer(29) to the transistor formed with the cap layer(30). |
申请公布号 |
KR100275715(B1) |
申请公布日期 |
2000.12.15 |
申请号 |
KR19930030229 |
申请日期 |
1993.12.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, BYUNG-HOO |
分类号 |
H01L21/22;H01L21/30;H01L21/31;H01L21/318;H01L21/336;H01L23/29;H01L29/78;H01L29/786;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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