| 摘要 |
<p>PROBLEM TO BE SOLVED: To transfer a lot of solder fixed on a bump sheet to a semiconductor chip in a short time b forming the bump sheet into a strip or tape while a slit is so provided as to surround solders which are to be transferred. SOLUTION: A bump sheet 1 is aligned with a semiconductor chip, and a solder 2 fixed on the bump sheet 1 is transferred to the semiconductor chip. In short, a semiconductor chip aligned to the bump sheet 1 on a fixing device is fixed and heated to a specified temperature. Solder groups 2 which are arrayed proportional to the electrode array of an LSI chip are provided with constant intervals on a bump sheet part 5, with slits 3 formed at points for avoiding heat radiation of heat conductivity. The slits 3 are linearly formed, by four, to surround the bump sheet part 5, or formed in L-shape at a corner part. Thus, a lot of solders are transferred at high reliability in a short time.</p> |
