发明名称 VIBRATION PROOF DEVICE HAVING HEAT TRANSFER STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a vibration proof device where a heat transfer and vibration proof are realized at the same time, while an effective heat-radiation function is provided, with ease of adjustment of the optimization of the resonance frequency of a vibration-proof system. SOLUTION: A heating body 4 is mounted on the upper surface of the vessel 2, which is fitted above a heat-transfer surface 1A, elastically deformed easily, with a cooling medium 3 of satisfactory thermal conductivity sealed in the vessel 2. The heat from the heating body 4 is transported to the heat-transfer surface 1A through convection and conduction of the cooling medium 3 in the vessel 2, and additionally when the heat-transfer surface 1A vibrates, the cooling medium 3 is agitated and is further promoted in heat transfer. In order to cope with the vibration of the heat-transfer surface 1A, the deformation of the vessel 2 and the cooling medium 3 suppress the transfer of the vibration impact to the heating body 4 to a minimum, and through adjustment of the liquid amount and the pressure of the cooling medium 3 optimizes the resonance frequency is optimized.
申请公布号 JP2000349214(A) 申请公布日期 2000.12.15
申请号 JP19990158782 申请日期 1999.06.04
申请人 MITSUBISHI ELECTRIC CORP 发明人 HAYASHI KAZUHIKO;OSUMI NORITOSHI
分类号 H01L23/473;(IPC1-7):H01L23/473 主分类号 H01L23/473
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