| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inspection jig for electronic circuit board that can solve problems caused by using a probe, obtain certain conduction regardless of the thickness of a protective layer, improve the manufacturing yield, and can be speedily and rapidly manufactured. SOLUTION: This inspection jig is brought into pressure contact with an electronic circuit board 1 to inspect an electric characteristic of the electronic circuit board 1. A plurality of pads are arranged in parallel on the rear surface of the electronic circuit board 1, wiring patterns 3 electrically connected to the plurality of pads are provided on the front surface of the electronic circuit board 1, resist printed layers 4 for protecting the wiring patterns 3 are laminated, and a plurality of connecting groove holes 6 for exposing electrodes 7 of the wiring patterns 3 are drilled on the resist printed layers 4. The inspection jig is made of conductive rubber 8, frame-shaped projecting pieces 9 and surrounding projecting pieces 10 loosely engaged with respective connecting groove holes 6 are engraved with laser on the surface facing the resist printed layers 4 of the conductive rubber 8 to make these contact with the electrodes 7. Based on the contact of the frame-shaped projecting pieces 9 and the surrounding projecting pieces 10 to the electrodes 7, the wiring patterns 3 are short-circuited to inspect existence of disconnection. By using the laser engraving method, the jig can flexibly cope with specification change of a circuit pattern or the resist printed layer 4.
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