| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device and a method of manufacturing the same, where a connection is properly made even if a board is warped or uneven. SOLUTION: An electronic device 1 is fabricated through such a manner where high-temperature solders 5 having a higher melting point than a usual solder are each formed on the electrodes of a board 2 when a warped or uneven board 2 mounted with electronic parts 3 is connected to a mother board through a protrudent electrodes 7, metal balls 6 having a higher melting point than a usual solder are each attached to the tips of the high-temperature solders 5 to form the protrudent electrodes 7 which are each composed of the solder 5 and the metal ball 6, the metal balls 6 are pulled up separating from the board 2 so as to be positioned on a virtual plane indicated by a broken line in a state where the high-temperature solders 5 are brought in contact with the board 2, and the metal balls 6 are irradiated with a laser beam to melt the high-temperature solders 5 for joining the protrudent electrodes 7 to the board 2.
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