| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor device and a connection solder ball base reinforcing method, where a thick film can be applied around solder balls, and resin hardly crawls up to the solder balls. SOLUTION: A semiconductor device is equipped with a package 10 where an integrated circuit element is sealed up, electrode pads 11 formed on the surface of the package 10, solder balls 20 each bonded to the surfaces of the electrode pads 11, an insulating board 30 provided with an underfill material potting opening 32 through which underfill material is injected and solder ball openings 33 and equipped with a spacer 31 which is provided for keeping a space between the board 30 and the package 10, and an underfill material 40 which is filled in a space between the package 10 and the insulating board 30.
|
