| 发明名称 |
Jet solder delivery device has protruding sections around each jet opening in corrugated plate |
| 摘要 |
The device delivers molten solder to a substrate by spraying it from a number of jet openings (22) formed on a corrugated plate (21). The wall sections (22a) surrounding each opening on the plate stands proud from the corrugated plate. The wall sections may be formed by stamping. An Independent claim is included for a method of soldering a substrate.
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| 申请公布号 |
DE10025899(A1) |
申请公布日期 |
2000.12.14 |
| 申请号 |
DE20001025899 |
申请日期 |
2000.05.25 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD., OSAKA |
发明人 |
KOSHI, MASUO;SUGIMOTO, TADAHIKO;NAKAYAMA, HIROAKI;TODOROKI, KENICHIROU |
| 分类号 |
B23K1/00;B05B1/14;B05C3/18;B05C11/10;B23K1/08;B23K3/06;H05K3/34;(IPC1-7):B23K3/06 |
主分类号 |
B23K1/00 |
| 代理机构 |
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