METHOD OF MODIFYING A SURFACE OF A STRUCTURED WAFER

摘要

A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry.