| 摘要 |
<p>A photosensitive device (46) with a microlens array (44) may be packaged for surface mount packaging (48) and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.</p> |
