| 摘要 |
<p>A multilayer printed wiring board in which the strength is ensured by sandwiching a metal layer (18) between insulating layers (14, 20), thereby a core sheet (30) can be thin, and the thickness of the multilayer printed wiring board is reduced. Moreover, since a blind hole (22) extending to the metal layer (18) is formed only in insulating layers (14, 20), the fine blind hole (22) can easily be made by a laser beam, and a through hole (36) having a small diameter can be formed.</p> |
