LIGHT-RECEIVING ELEMENT ARRAY DEVICE AND OPTICAL DEMULTIPLEXER USING THE SAME

摘要

The light receiving part of a photodetector array chip can be placed close t o an input fiber so as to be applicable to a Littrow-mounted optical demultiplexer. The coma is suppressed and the length of the optical system i s shortened to reduce the size of the optical demultiplexer. A rectangular chi p which has a light receiving part comprising a number of photodetectors arranged into an array is enclosed in a rectangular package with an outer le ad and the bonding pads of the chip are connected to the bonding terminals of t he package with bonding wires etc. to constitute a photodetector array. The device has a structure in which the chip is housed in the package so as to b e close to one side of the package and one of the following three contrivances or a combination of them is employed: (1) Bonding pads are not provided alon g one long side near the light receiving part of the chip. (2) Bonding termina ls are not provided along one long side of the package. (3) An outer lead is no t provided along one long side of the package.