| 摘要 |
<p>An electronic component which is friendly to the global environment and which possesses improved reliability of the junction between external terminals of the electronic component and a circuit pattern on a printed circuit board. An electronic apparatus in which the electronic component is mounted and a method of its manufacture are disclosed. The electronic component has lead wires the outermost layer of which is an Sn-Cu alloy layer or has external terminals the outermost layer of which is an Sn-Cu alloy layer. The method of manufacturing the electronic apparatus includes a step of electrically connecting the electronic component to a desired pattern on a printed wiring board by means of an Sn-Cu alloy layer.</p> |
