| 摘要 |
<p>The module has at least one power semiconductor element pressure contacted on a base plate (1) with electric separation by an insulating disc, and is conductively coupled with associated contact faces by couplers, while being enclosed in a housing (3,9). The base plate and the housing are tightly connected by a two-side adhesive, flexible plastics foil (202). At least one power semiconductor element is insulatingly pressure contacted with a contact rail (205) and coupling conductor (53) by expansion screws (210). There is an alterative contacting of gate terminals (207).</p> |
