| 摘要 |
The invention concerns a method for interleaving an electronic module (1), the module in the form of a central block (12) and a peripheral edge (11) is received in a staged cavity (20) provided therefor in the card body (2) and fixed by hot-bonding under pressure of its edge (11) into the peripheral rim of the cavity (20). The invention is characterised in that, during the hot process pressing, the card (2) zone constituting the base of the cavity (20) is subjected externally to a vacuum. |
