发明名称 Vorrichtung zum Polieren und zur Regelung der Grösse des Teilchens in einem Verfahren zum Pulverisieren und zur Trennung
摘要 <p>The materials to be treated, for instance, molded resin articles with resin films coated thereon are treated by relatively simple means to separate and remove the resin film coatings from the surfaces thereof, and are further treated to recover them as a raw-form of resin material or a resin material regulated such that its particle diameter lies within a given particle diameter range, or the materials to be treated, for instance, powder materials are pulverized and granulated. A molded resin article is crushed to small pieces, to which compression impacts based on fine vibrations are in turn applied for squeezing, and resin film coatings separated off the small pieces are removed. The thus treated small pieces are further re-pulverized, and frictional crushing impacts are applied to the thus pulverized pieces as well for polishing and size-regulation. Alternatively, directional fine vibrations are applied to one of the inner and outer compression impact surfaces of inner and outer compression impact members that are located in opposition to each other with a given gap between them to pulverize and squeeze the material to be treated that is fed between the compression impact surfaces, thereby separating surface thin films therefrom for granulation. <IMAGE></p>
申请公布号 DE69231183(T2) 申请公布日期 2000.12.14
申请号 DE1992631183T 申请日期 1992.10.26
申请人 EIN CO., LTD. TECHNICAL CENTER 发明人 NISHIBORI, SADAO;ITAKURA, YUZO
分类号 B02C2/04;B02C13/22;B02C21/00;B29B13/10;B29B17/02;(IPC1-7):B29B17/02;B02C18/44 主分类号 B02C2/04
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