| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board, which can suppress sink on of a filler without increasing the amount of the filler. SOLUTION: The printed wiring board 11 has a plated through hole 16 formed. The filler 17 is injected into the through hole 16. Namely, the through hole 16 is filled with the filler 17. In this process, the filler 17 which is liquid and has liquidity is injected into the through hole 16. Then the filler 17 is hardened at a specific temperature for a specific time. |
