| 摘要 |
PROBLEM TO BE SOLVED: To efficiently mount plural IC chips on a substrate with better productivity, and moreover, less manufacturing devices. SOLUTION: This is the multiple chip mounting structure wherein plural IC chips 12a, 12b having respective bumps 14a, 14b are mounted on a substrate 11 provided with substrate side terminals 16a, 16b so that the substrate side terminals 16a, 16b are brought into conductive contact with the bumps 14a, 14b. The bumps 14a, 14b arranged for the plural chips 12a, 12b form terminal array pairs opposing to each other. Since the plural IC chips 12a, 12b are mounted on the substrate 11 so that the center lines L1, L2 between the terminal array pairs formed respectively coincide with each other, the position of the press-contacting head does not need to be changed, and also one sheet of ACF 19 can be used commonly. |
