METHOD FOR BONDING AN ELECTRODE OF A CERAMIC DEVICE TO A CONNECTION SUBSTRATE BY USING A HIGH FREQUENCY HEATER

摘要

PURPOSE: A method for bonding an electrode of a ceramic device to a connection substrate is provided to reduce the bonding time by bonding the electrode to the connection substrate using a high frequency heater CONSTITUTION: A high frequency heater is connected to two electrodes. After aligning two electrodes on an induced coil heater(4), the induced coil heater(4) generates the high frequency power to bond the electrodes. When a thin connection substrate(5) is bonded to a wire(2) or when the thin connection substrate(4) is bonded to another connection substrate(4), a thin metal film is coated on the wire(2) or on an opposite side of the connection substrate. In this state, the high frequency is applied by the high frequency heater so as to bond the thin connection substrate(5) to the wire(2).