RESIST MASK AND ITS FORMATION

摘要

PROBLEM TO BE SOLVED: To easily obtain a coating film having high uniformity and to manufacture a high precision mask by forming a resist film from plural resist layers and controlling the thickness of each of the resist layers. SOLUTION: A mask substrate 1 comprises quartz glass 2 and a light shielding film 3 laminated on the glass 2. A resist film 4 is formed on the mask substrate 1 by laminating 1st to 3rd resist layers 4a-4c. The resist film 4 is formed from the plural resist layers 4a-4c and the thickness of each of the resist layers 4a-4c is controlled. Since unevenness in the thickness of a resist film by a rotary cup system is caused in the drying of an applied resist and is in proportion to the thickness of a coating film, the unevenness can be reduced by dividedly applying the resist.