| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a power-supply and heat-radiating device for a power semiconductor element, where the power supply structure of the power semiconductor element attached to a circuit board is simplified, and is provided with heat radiation function. SOLUTION: In an electric circuit using a plurality of power semiconductor elements 1, the power semiconductor element 1 comprises a heat-radiation metal plate, where the electrode in the element is electrically connected inside the package of semiconductor. Among the plurality of power semiconductor elements 1, such heat-radiating metal plate as the electric potential of the electrode connected to the heat-radiating metal plate is identical is allowed to be conductive to one heat-radiating body 6 for adhesion, using the heat-radiating body 6 as one connection terminal. A plurality of heat-radiating bodies 6 are allowed to be conductive to one conductive heat-radiating plate 7 for adhesion, using the heat-radiating plate as one connection terminal. The heat-radiating plate is fitted tightly to other heat radiator 11, while being electrically insulated.</p> |
