发明名称 Thermal diaphragm pressure sensor
摘要 <p>A pressure sensor of the present invention comprises a diaphragm 6 having a first surface which receives pressure and a thermal detecting portion 3 with a heat sensitive portion disposed as to oppose the diaphragm through a spacer, wherein displacement values of the diaphragm owing to variations in pressure are detected at the thermal detecting portion as variation values of thermal equilibrium state. With this arrangement, a surface of the diaphragm which directly receives pressure from measuring fluid does not need to undergo film forming or photolithographic processes whereby main portions of thermal pressure detecting elements might be formed onto a silicon substrate by large quantities in a lump sum through simple manufacturing processes so that it is possible to improve accuracy and reliability of the thermal pressure detecting elements and to obtain a pressure sensor of low cost. <IMAGE></p>
申请公布号 EP1059517(A1) 申请公布日期 2000.12.13
申请号 EP19990923874 申请日期 1999.06.03
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OHJI, HIROSHI;TSUTSUMI, KAZUHIKO;SAKAI, YUICHI;YUTANI, NAOKI
分类号 G01L11/00;G01L19/04;(IPC1-7):G01L11/00 主分类号 G01L11/00
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